In order to meet the different application needs of many customers in this field, the company has developed a wide variety of products suitable for capacitor potting, starter motor dripping, power semiconductor, various types of sensors, filters, electromagnetic devices, control modules, electronic temperature protectors and other electronic and electrical products insulation packaging, the company adheres to the advanced epoxy modification technology, The flexible packaging materials with the characteristics of epoxy packaging materials were developed. Products with fluidity, high thermal conductivity, excellent operability, proportion, reactivity and curing hardness wide variety, low stress cracking resistance products.
The main application areas of these products are::